RO3210 2-Layer 30mil ENIG PCB for High-Frequency Wireless and Automotive Applications
1.Introduction
Rogers' RO3210 high-frequency circuit materials are ceramic-filled laminates reinforced with woven fiberglass. These materials are engineered to deliver outstanding electrical performance and mechanical stability, with a unique combination of surface smoothness and rigidity. RO3210 laminates merge the fine-line etching tolerances of non-woven PTFE with the structural strength of woven-glass PTFE, making them suitable for standard PTFE PCB processing techniques.
2.Key Features
Dielectric Constant (Dk): 10.2 +/- 0.5
Dissipation Factor: 0.0027 at 10GHz
Thermal Conductivity: 0.81W/mk
CTE Matched to Copper: 13 ppm/°C (x, y), 34 ppm/°C (z)
Decomposition Temperature (Td): 500°C (TGA)
Flammability Rating: V0 (UL 94 standard)
Surface Finish: Immersion Gold (ENIG)
Board Thickness: 0.8mm (30mil core)
3.Benefits
Woven Glass Reinforcement: Enhances rigidity for easier handling and processing.
Uniform Performance: Ensures reliability for complex multi-layer high-frequency designs.
Low CTE: Matched to copper for reliable surface-mounted assemblies and hybrid designs.
Dimensional Stability: Improves production yields and consistency.
Smooth Surface: Enables finer line etching tolerances for precision circuits.
4.PCB Construction Details
| Parameter | Specification |
|---|
| Base Material | RO3210 | '
| Layer Count | 2-layer |
| Board Dimensions | 16mm × 8mm (±0.15mm) |
| Min Trace/Space | 4/7 mils |
| Min Hole Size | 0.3mm |
| Via Type | Through-hole only (No blind vias) |
| Board Thickness | 0.8mm |
| Copper Weight | 1oz (1.4 mils) outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold (ENIG) |
| Top Silkscreen | White |
| Bottom Silkscreen | None |
| Top Solder Mask | Green |
| Bottom Solder Mask | None |
| Electrical Testing | 100% tested prior to shipment |
5.PCB Stackup (2-Layer Rigid Structure)
Copper layer 1 - 35 μm
Rogers RO3210 Core - 0.762 mm (30mil)
Copper layer 2 - 35 μm
6.PCB Statistics:
Components: 3
Total Pads: 10
Thru Hole Pads: 6
Top SMT Pads: 4
Bottom SMT Pads: 0
Vias: 5
Nets: 2
7.Typical Applications
Automotive collision avoidance systems
GPS antennas
Wireless telecommunications
Microstrip patch antennas
Direct broadcast satellites
Power backplanes
Base station infrastructure
8.Quality Assurance
IPC-Class 2 compliant
100% electrical tested
Global availability
Gerber RS-274X support
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